Contactless EEPROM Wafer
Contactless EEPROM Wafer
ISO/IEC 18000-3 mode 1 1 fixed sector Up to 65,536 units, support of anti-tearing 224Byte 64Byte Unique serial number, individual page locking Typically up to 1.5m 26.48kbit/s 100,000 10 years NiAu-bump, Wafer, MCC2, MCC8 Evaluation Kit Contactless
Especificações
| Brand | Infineon |
|---|---|
| Product description | mm |
| Supplier | Wafer |
| Operating temperature | -25 to 70 °C |
| Schedule B | 8542330000 |
| HTSN | 8542330001 |
| Category | Contactless EEPROM |
SKU: SRF 55V02P NB