USB Controller 121-Pin F-BGA

Cypress’s EZ-USB FX3 is a SuperSpeed peripheral controller, providing integrated and flexible features. FX3 has a fully configurable, parallel, general programmable interface called GPIF II, which can connect to any processor, ASIC, or FPGA. GPIF II is an enhanced version of the GPIF in FX2LP, Cypress’s flagship USB 2.0 product. It provides easy and glueless connectivity to popular interfaces, such as asynchronous SRAM, asynchronous and synchronous address data multiplexed interfaces, and parallel ATA.

• Universal serial bus (USB) integration
  • USB 3.1, Gen 1 and USB 2.0 peripherals compliant with USB 3.1 Specification Revision 1.0 (TID # 340800007)
  • 5-Gbps SuperSpeed PHY compliant with USB 3.1 Gen 1
  • High-speed On-The-Go (HS-OTG) host and peripheral compliant with OTG Supplement Version 2.0
  • Thirty-two physical endpoints
  • Support for battery charging Specification 1.1 and accessory charger adaptor (ACA) detection
• General Programmable Interface (GPIF™ II)
  • Programmable 100-MHz GPIF II enables connectivity to a wide range of external devices
  • 8-, 16-, 24-, and 32-bit data bus
  • Up to16 configurable control signals
• Fully accessible 32-bit CPU
  • ARM926EJ core with 200-MHz operation
  • 512-KB or 256-KB embedded SRAM
• Additional connectivity to the following peripherals
  • SPI master at up to 33 MHz
  • UART support of up to 4 Mbps
  • I2C master controller at 1 MHz
  • I2S master (transmitter only) at sampling frequencies of 32 kHz, 44.1 kHz, and 48 kHz
• Selectable clock input frequencies
  • 19.2, 26, 38.4, and 52 MHz
  • 19.2-MHz crystal input support
• Ultra low-power in core power-down mode
  • Less than 60 µA with VBATT on and 20 µA with VBATT off
• Independent power domains for core and I/O
  • Core operation at 1.2 V
  • I2S, UART, and SPI operation at 1.8 to 3.3 V
  • I2C operation at 1.2 V to 3.3 V
• Package options
  • 121-ball, 10- × 10-mm, 0.8-mm pitch Pb-free ball grid array (BGA)
  • 131-ball, 4.7- × 5.1-mm, 0.4-mm pitch wafer-level chip scale package (WLCSP)
  • See Table 20 for details on the eight FX3 variants
• EZ-USB® Software Development Kit (SDK) for code development of firmware and PC Applications
  • Includes RTOS Framework (using ThreadX Version 5)
  • Firmware examples covering all I/O modules
  • Visual Studio host examples using C++ and C#
• SuperSpeed Explorer Board available for rapid prototyping
  • Several accessory boards also available: Adapter boards for Xilinx/Altera FPGA development, Adapter board for Video development, CPLD board for concept testing and initial development