Transmitter 132-Pin BGA

GD16585 is transmitter chips used in SDH STM-64 and SONET OC-192 optical communication systems. The device is available in two versions: GD16585 for 9.5328 Gbit/s. GD16589 for 10.66 Gbit/s with Forward Error Correction (FEC). Except the different operating bit rate the two versions are functional identical. The transmitter integrates the main functions of the serializer which are: Clock Multiply Unit (CMU) 16:1 Multiplexer in a single monolithic IC. The CMU consists of Phase Locked Loop (PLL) controlled from an external reference clock. The PLL characteristics are controlled by an external loop filter allowing the user to optimize the jitter perfomance of the device. The 16:1 Multiplexer accepts 16 parallel input bits at 622.88 Mbit/s (or 666 Mbit/s) that are serialized into a 9.9538 Gbit/s (or 10.66 Gbit/s) data stream. The serialized data stream is re-timed by the highspeed clock from the VCO. The parallel input interface features GIGA’s unique self-synchronizing dynamic phase alignment scheme that allows both: Source synchronous counter clocking for OIF99.102.5 interfaces. Forward clocking with phase nulling and jitter clean-up of the clock. These schemes enable the serializer to absorb output delay variations from the upstream System ASIC without use of initialization or reset. The data and clock inputs to the MUX are LVDS and the output data is CML compatible. The device operates from a dual -5.2 V and +3.3 V power supply. The power dissipation is 2.2 W, typical. The device is manufactured in a Silicon Bipolar process and packaged in an 132 balls 13 × 13 mm Ceramic/Plastic Ball Grid Array (CBGA).

• PLL based CMU with on-chip 10 GHz or 10.66 GHz VCO.
• 16:1 Multiplexer with a last stage re-timing.
• OIF99.102.5 compliant timing .
• LVDS compatible parallel data and clock inputs
• CML compatible serial data output.
• 155 MHz or 622 MHz reference clock input (selectable).
• Divide by 16 clock output.
• PLL out of lock detector.
• Dual supply operation: -5.2 V and +3.3 V
• Low power dissipation: 2.2 W (typ.).
• Available in three package versions:
  • EB: 132 ball (16 mill) Ceramic BGA 13 × 13 mm
  • EF: 132 ball (20 mill) Ceramic BGA 13 × 13 mm
  • FB: 132 ball (20 mill) Plastic BGA 13 × 13 mm
• Available in two versions:
  • GD16585 for 10 Gbit/s
  • GD16589 for 10.66 Gbit/s