SMSCIM21U151NE
SMSCIM21U151NE
- Perfect shape for automatic mounting, with no directionality
- Excellent solderability and high heat resistance for either flow or reflow soldering
- Monolithic inorganic material construction for high reliability
- Closed magnetic circuit configuration avoids crosstalk and is suitable for high density PCBs
Характеристики
| Бренд | Samsung |
|---|---|
| Core Material | Ferrite |
| Рабочая температура | -55 to 125 °C |
| Tolerance | 25 % |
| Test Frequency | 100 MHz |
| Technology | Wirewound |
| Длина | 2 mm |
| Type Prod | Chip Bead |
| Schedule B | 8504900080 |
| HTSN | 8504508000 |
| Страна происхождения | Korea, South |
| Protectio | Molded |
| Упаковка | Embossed Tape and Reel |
| Maximum D | 150 MOhm |
| Maximum D | 600 mA |
| Family | CIM |
| Impedance | 150 Ohm |
SKU: CIM21U151NE