SDCSDIN5D2-4G-L

The SDIN5D2 is an Embedded Flash Drive (EFD) designed for mobile handsets and consumer electronic devices. SDIN5D2 is a hybrid device combining an embedded thin flash controller and standard MLC NAND flash memory, with an industry standard e.MMC 4.41 interface.Empowered with a new e.MMC4.41 feature set such as Boot and RPMB partitions, HPI (implemented on MLC products only) , and HW Reset the SDIN5D2 e.MMC is the optimal device for reliable code and data storage.Designed specifically for mobile multimedia applications, SDIN5D2 is the most mature on board SD/MMC device since 2005, providing mass storage of up to 64GB in JEDEC compatible form factors, with low power consumption and high performance - an ideal solution for multimedia handsets of 2.5G, 3G, 3.5G and 4G.In addition to the high reliability and high system performance offered by the current SDIN5D2 family of products, SDIN5D2 offers plug-and-play integration and support for multiple NAND technology transitions, as well as features such as advanced power management scheme.The SDIN5D2 uses advanced Multi-Level Cell (MLC) NAND flash technology, enhanced by embedded flash management software running as firmware on the flash controller.The SDIN5D2 architecture and embedded firmware fully emulates a hard disk to the host processor, enabling read/write operations that are identical to a standard, sector-based hard drive. In addition, firmware employs patented methods, such as virtual mapping, dynamic and static wear leveling, and automatic block management to ensure high data reliability and maximize flash life expectancy.The SDIN5D2 provides up to 64GB of memory for use in mass storage applications. In addition to the mass-storage-specific flash memory chip, SDIN5D2 includes an intelligent controller, which manages interface protocols, data storage and retrieval, error correction code (ECC) algorithms, defect handling and diagnostics, power management and clock control.

• Memory controller and NAND flash
• Complies with e.MMC Specification Ver. 4.41²
• Mechanical design complies with JEDED MO-276C Specification
• Offered in five TFBGA packages of e.MMC 4.41³
  • 11.5mm x 13mm x 1.0mm (2GB, 4GB,8GB)
  • 11.5mm x 13mm x 1.2mm (16GB)
• Operating temperature range: -25°C to +85°C
• Dual power system
• Core voltage (Vcc) 2.7-3.6V
• I/O (Vccq) voltage, either: 1.7-1.95V or 2.7-3.6V
• Up to 64GB of data storage
• Supports three data bus widths: 1bit (default), 4bit, 8bit
• Variable clock frequencies of 0-20 MHz, 0-26 MHz (default), 0-52 MHz (high-speed)
• Up to 104 MB/sec bus transfer rate, using 8 parallel data lines at 52 MHz, DDR Mode
• Correction of memory field errors
• Designed for portable and stationary applications that require high performance and reliable data storage