OM13495 Surface Mount to DIP Evaluation Board

The OM13491 allows one to evaluate small, surface mount devices by breaking out the package leads to 100 mil centers pins, emulating a DIP package. The OM13491 supports the following packages: SO8 (SOT96), VSSOP8 (SOT765), XQFN8 (SOT902), HWSON8 x 2 (SOT1069), MSOP8 x 2 (SOT505).

Easy connection to small surface mount packages

Allows evaluation of device that are only available in surface mount packages

100 mil center headers emulate DIP package for easy bread boarding

Eliminates costly sockets and custom printed circuit boards

Expand the kit with add-on I²C daughter cards