NAND Flash Memory

package-on-package (PoP) products combine NAND Flash and Mobile LPDRAM devices in a single MCP. These products target mobile applications with low-power, high-performance, and minimal package-footprint design requirements. The NAND Flash and Mobile LPDRAM devices are also members of the discrete memory products portfolio.The NAND Flash and Mobile LPDRAM devices are packaged with separate interfaces (no shared address, control, data, or power balls). This bus architecture supports an optimized interface to processors with separate NAND Flash and Mobile LPDRAM buses. The NAND Flash and Mobile LPDRAM devices have separate core power connections and share a common ground (i.e., VSS is tied together on the two devices).

• Micron® NAND Flash and Mobile LPDRAM components
• RoHS-compliant, “green” package
• Separate NAND Flash and Mobile LPDRAM interfaces
• Space-saving package-on-package combination
• Low-voltage operation (1.70-1.95V)
• Industrial temperature range: -40°C to +85°C