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LIN Fail Safe System Basis Chip 20Kbps 32-Pin HTSSOP T/R

The UJA1069 fail-safe System Basis Chip (SBC) replaces basic discrete components which are common in every Electronic Control Unit (ECU) with a Local Interconnect Network (LIN) interface. The fail-safe SBC supports all networking applications which control various power and sensor peripherals by using LIN as a local sub-bus. The fail-safe SBC contains the following integrated devices: In addition to the advantages of integrating these common ECU functions in a single package, the fail-safe SBC offers an intelligent combination of system-specific functions such as: The UJA1069 is designed to be used in combination with a microcontroller and a LIN controller. The fail-safe SBC ensures that the microcontroller is always started up in a defined manner. In failure situations the fail-safe SBC will maintain the microcontroller function for as long as possible, to provide full monitoring and software driven fall-back operation. The UJA1069 is designed for 14 V single power supply architectures and for 14 V and 42 V dual power supply architectures.

General

  • Contains a full set of LIN ECU functions:
    • LIN transceiver
    • Voltage regulator for the microcontroller (5.0 V)
    • Enhanced window watchdog with on-chip oscillator
    • Serial Peripheral Interface (SPI) for the microcontroller
    • ECU power management system
    • Fully integrated autonomous fail-safe system
  • Designed for automotive applications:
    • Supports 14 V and 42 V architectures
    • Excellent ElectroMagnetic Compatibility (EMC) performance
    • +-8 kV ElectroStatic Discharge (ESD) protection Human Body Model (HBM) for off-board pins
    • +-4 kV ElectroStatic Discharge (ESD) protection IEC 61000-4-2 for off-board pins
    • +-60 V short-circuit proof LIN-bus pin
    • Battery and LIN-bus pins are protected against transients in accordance with ISO 7637-3
    • Very low sleep current
  • Supports remote flash programming via the LIN-bus
  • Available in:
    • Small 6.4 mm x 7.8 mm HTSSOP24 package with low thermal resistance
    • Small 8 mm x 11 mm HTSSOP32 package with low thermal resistance

LIN transceiver

  • LIN 2.0 and SAE J2602 compliant LIN transceiver
  • Enhanced error signalling and reporting
  • Downward compatible with LIN 1.3 and the TJA1020

Power management

  • Smart operating modes and power management modes
  • Cyclic wake-up capability in Standby and Sleep mode
  • Local wake-up input with cyclic supply feature
  • Remote wake-up capability via the LIN-bus
  • External voltage regulators can easily be incorporated in the power supply system (flexible and fail-safe)
  • 42 V battery related high-side switch for driving external loads such as relays and wake-up switches
  • Intelligent maskable interrupt output

Fail-safe features

  • Safe and predictable behavior under all conditions
  • Programmable fail-safe coded window and time-out watchdog with on-chip oscillator, guaranteeing autonomous fail-safe system supervision
  • Fail-safe coded 16-bit SPI interface for the microcontroller
  • Global enable pin for the control of safety-critical hardware
  • Detection and detailed reporting of failures:
    • On-chip oscillator failure and watchdog alerts
    • Battery and voltage regulator undervoltages
    • LIN-bus failures (short-circuits)
    • TXDL and RXDL clamping situations and short-circuits
    • Clamped or open reset line
    • SPI message errors
    • Overtemperature warning
  • Rigorous error handling based on diagnostics
  • Supply failure early warning allows critical data to be stored
  • 23 bits of access-protected RAM is available e.g. for logging of cyclic problems
  • Reporting in a single SPI message; no assembly of multiple SPI frames needed
  • Limp-home output signal for activating application hardware in case system enters Fail-safe mode (e.g. for switching on warning lights)
  • Fail-safe coded activation of Software development mode and Flash mode
  • Unique SPI readable device type identification
  • Software-initiated system reset

Характеристики

Бренд NXP
Screening Level Extended Industrial
Operating 3 mA
Power Sup Single
Описание продукта 11.1(Max) x 6.2(Max) x 0.95(Max) mm
Рабочая температура -40 to 125 °C
Schedule B 8542390000
Type Prod LIN Fail Safe System Basis Chip
HTSN 8542390001
Страна происхождения Thailand
Supplier HTSSOP
Lead Finish Gold|Silver Over Nickel Palladium
Max Proce 260 °C
Msl Level 3
Maximum D 20 Kbps
Operating 5.5 to 27|5.5 to 52 V
SKU: UJA1069TW/5V0/C/T Поставщик: по запросу