Integrated Off-Line Switcher 11-Pin EDIP-B

TOPSwitch-JX cost effectively incorporates a 725 V power MOSFET, high-voltage switched current source, multi-mode PWM control, oscillator, thermal shutdown circuit, fault protection and other control circuitry onto a monolithic device

• EcoSmart – Energy Efficient
• Ideal for applications from 10 W to 245 W
• Energy efficient over entire load range
• No-load consumption below 100 mW at 265 VAC
• Up to 750 mW standby output power for 1 W input at 230 VAC High Design Flexibility for Low System Cost
• Multi-mode PWM control maximizes efficiency at all loads
• 132 kHz operation reduces transformer and power supply size
• 66 kHz option for highest efficiency requirements
• Accurate programmable current limit
• Optimized line feed-forward for line ripple rejection
• Frequency jittering reduces EMI filter cost
• Fully integrated soft-start for minimum start-up stress
• 725 V rated MOSFET
• Simplifies meeting design derating requirements Extensive Protection Features
• Auto-restart limits power delivery to <3% during overload faults
• Output short-circuit protection (SCP)
• Output over-current protection (OCP)
• Output overload protection (OPP)
• Output overvoltage protection (OVP)
• User programmable for hysteretic/latching shutdown
• Simple fast AC reset
• Primary or secondary sensed
• Line undervoltage (UV) detection prevents turn-off glitches
• Line overvoltage (OV) shutdown extends line surge withstand
• Accurate thermal shutdown with large hysteresis (OTP) Advanced Package Options
• eDIP™-12 package:
• 43 W / 117 W universal input power output capability with PCB / metal heat sink
• Low profile horizontal orientation for ultra-slim designs
• Heat transfer to both PCB and heat sink
• Optional external heat sink provides thermal impedance equivalent to a TO-220
• eSIP™-7C package:
• 177 W universal input output power capability
• Vertical orientation for minimum PCB footprint
• Simple heat sink mounting using clip provides thermal impedance equivalent to a TO-220
• eSOP™-12 package:
• 66 W universal input output power capability
• Low profile surface mounted for ultra-slim designs
• Heat transfer to PCB via exposed pad and SOURCE pins
• Supports wave or reflow soldering
• Extended creepage to DRAIN pin
• Heat sink is connected to SOURCE for low EMI