Heat Sink Spreader BGA/PGA/QFP Thin Copper

When space is at a premium, Aavid’s Thin-fin heat sinks reduce package case temperature by as much as 20ºC. These flexible, copper spreaders attach to the electronic package using pre-applied adhesive, providing an off-theshelf solution for PCI and AGP chip sets. A laminated dielectric coating prevents shorting, making the Thin-Fin ideal for BGA devices and multimedia applications. Offer significant cooling with limited headroom • Pre-applied adhesive for rapid assembly • Dielectric coating prevents shorting • Fits many IC package styles<CRLF>