Heat Sink Passive Pin Array Adhesive 19.6°C/W Black Anodized
Heat Sink Passive Pin Array Adhesive 19.6°C/W Black Anodized
- Natural convection is 19.6
- With pre-applied adhesive, just peel off the release liner and press onto the component
- Reduces assembly costs; no more messy adhesives or greases required
- Excellent mechanical bond
- Thermally optimized pin fin
- Omnidirectional
- Adhesive shear strength at 100°C is 36psi (a one inch square heat sink would require a 36lb. force to remove heat sink)
- Applicable for BGA, PGA, PLCC, and QFP packages
Характеристики
| Бренд | CTS |
|---|---|
| Thermal R | 19.6 °C/W |
| Описание продукта | 30.734 x 30.734 x 9.017 mm |
| Type Prod | Passive |
| Fin Style | Pin Array |
| Schedule B | 8473300002 |
| HTSN | 8473305100 |
| Страна происхождения | Китай |
| Attachmen | Adhesive Tape |
| Длина | 30.734 mm |
SKU: BDN12-3CB/A01