Fuse Chip 0.5A 600V 2-Pin Solder Pad Surface Mount T/R
Fuse Chip 0.5A 600V 2-Pin Solder Pad Surface Mount T/R
- For use in telecommunication circuit applications requiring low current protection with high surge tolerance
- Overcurrent protection to Telcordia GR-1089-CORE Issue 4 (B1250T only) & UL 1950/60950
- TISP products are recommended for the overvoltage section of the circuit
- RoHS compliant
Характеристики
| Бренд | Bourns |
|---|---|
| Описание продукта | 9.65 x 3.05 x 3.05 mm |
| Voltage Rating | 600 V |
| Schedule B | 8533400080 |
| HTSN | 8533408050 |
| Страна происхождения | Китай |
| Maximum A | 600 V |
| Type Prod | Chip |
| Lead Finish | Tin |
| Fuse Material | Ceramic |
| Max Proce | 260 |
| Рабочая температура | -55 to 125 °C |
| Maximum P | 0.2 W |
SKU: B0500T