Flash Card 32G-byte 3V/3.3V Embedded MMC 169-Pin TFBGA

The SDIN5B2 is an Embedded Flash Drive (EFD) designed for mobile handsets and consumer electronic devices.SDIN5B2 is a hybrid device combining an embedded thin flash controller and standard MLC NAND flash memory, with an industry standard e.MMC 4.411 interface. Empowered with a new e.MMC4.41 feature set such as Boot and RPMB partitions, HPI, Background Operations and HW Reset the SDIN5B2 e.MMC is the optimal device for reliable code and data storage.Designed specifically for mobile multimedia applications, SDIN5B2 is the most mature on board SD/MMC device since 2005, providing mass storage of up to 32GB in JEDEC compatible form factors, with low power consumption and high performance - an ideal solution for multimedia handsets of 2.5G, 3G, 3.5G and 4G. In addition to the high reliability and high system performance offered by the current SDIN5B2 family of products, SDIN5B2 offers plug-and-play integration and support for multiple NAND technology transitions, as well as features such as advanced power management scheme.SDIN5B2 uses advanced Multi-Level Cell (MLC) NAND flash technology, enhanced by embedded flash management software running as firmware on the flash controller. SDIN5B2 architecture and embedded firmware fully emulates a hard disk to the host processor, enabling read/write operations that are identical to a standard, sector-based hard drive. In addition, firmware employs patented methods, such as virtual mapping, dynamic and static wear leveling, and automatic block management to ensure high data reliability and maximize flash life expectancy.SDIN5B2 provides up to 32GB of memory for use in mass storage applications. In addition to the mass-storage-specific flash memory chip, SDIN5B2 includes an intelligent controller, which manages interface protocols, data storage and retrieval, error correction code (ECC) algorithms, defect handling and diagnostics, power management and clock control.

• Memory controller and NAND flash
• Complies with e.MMC Specification Ver. 4.412
• Mechanical design complies with JEDED MO-276C Specification
• Offered in three TFBGA packages of e.MMC 4.413
  • 11.5mm x 13mm x 1.2mm (2GB)
  • 12mm x 16mm x 1.2mm (4GB, 8GB, 16GB)
  • 12mm x 18mm x 1.4mm (32GB)
• Operating temperature range: -25°C to +85°C
• Dual power system
• Core voltage (Vcc) 2.7-3.6V
• I/O (Vccq) voltage, either: 1.7-1.95V or 2.7-3.6V
• Up to 32 GB of data storage
• Supports three data bus widths
• Variable clock frequencies of 0-20 MHz, 0-26 MHz
• Up to 52 MB/sec bus transfer rate (using 8 parallel data lines at 52 MHz)
• Correction of memory field errors
• Designed for portable and stationary applications that require data storage