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DRAM Module DDR4 SDRAM 8Gbyte 260SODIMM

DRAM Module DDR4 SDRAM 8Gbyte 260SODIMM
  • JEDEC standard 1.2V ± 0.06V Power Supply
  • Vddq = 1.2V ± 0.06V
  • 800 MHz fCK for 1600Mb/sec/pin,933 MHz fCK for 1866Mb/sec/pin, 1067MHz fCK for 2133Mb/sec/pin,1200MHz fCK for 2400Mb/sec/pin
  • 16 Banks (4 Bank Groups)
  • Programmable CAS\ Latency: 11,13,15,17
  • Programmable Additive Latency (Posted CAS\) : 0, CL - 2, or CL - 1 clock
  • Burst Length: 8, 4 with tCCD = 4 which does not allow seamless read or write
  • Bi-directional Differential Data Strobe
  • On Die Termination using ODT pin
  • Average Refresh Period 7.8us at lower then Tcase 85°C, 3.9us at 85°C < Tcase = 95°C
  • Asynchronous Reset

Характеристики

Бренд Samsung
Schedule B 8473300002
HTSN 8473301140
Typical O 1.2000 V
Module Type 260SODIMM
Maximum C 1066 MHz
Organization 1Gx72
Total Density 8 GB
Sub Category DDR4 SDRAM
Supplier SODIMM
Data Bus Width 72 Bit
Main Category DRAM Module
Описание продукта 69.6 x 3.7(Max) x 30
Number Of 18
Chip Density 4 Gbit
Рабочая температура 0 to 85 °C
Screening Level Commercial
Chip Pack FBGA
SKU: M474A1G43DB0-CPB00 Поставщик: по запросу