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DRAM Module DDR3 SDRAM 4Gbyte 244RDIMM

DDR3 SDRAM modules are high-speed, CMOS dynamic random access memory modules that use internally configured 8-bank DDR3 SDRAM devices. DDR3 SDRAM modules use DDR architecture to achieve high-speed operation. DDR3 architecture is essentially an 8n-prefetch architecture with an interface designed to transfer two data words per clock cycle at the I/O pins. A single read or write access for the DDR3 SDRAM module effectively consists of a single 8n-bit-wide, one-clock-cycle data transfer at the internal DRAM core and eight corresponding n-bit-wide, one-half-clock-cycle data transfers at the I/O pins. DDR3 modules use two sets of differential signals: DQS, DQS# to capture data and CK and CK# to capture commands, addresses, and control signals. Differential clocks and data strobes ensure exceptional noise immunity for these signals and provide precise crossing points to capture input signals.
  • DDR3 functionality and operations supported as defined in the component data sheet
  • 244-pin, registered dual in-line, 82mm, memory module (Mini-RDIMM)
  • Fast data transfer rates: PC3-12800, PC3-10600, PC3-8500, or PC3-6400
  • 4GB (512 Meg x 72)
  • VDD = 1.5V ±0.075V
  • VDDSPD = +3.0V to +3.6V
  • Supports ECC error detection and correction
  • Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals
  • Dual rank
  • On-board I2C temperature sensor with integrated serial presence-detect (SPD) EEPROM
  • 8 internal device banks
  • Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS)
  • Selectable BC4 or BL8 on-the-fly (OTF)
  • Gold edge contacts
  • Halogen-free
  • Fly-by topology
  • Terminated control, command, and address bus

Характеристики

Бренд Micron
Schedule B 8542320023
HTSN 8542320024
Typical O 1.5000 V
Module Type 244RDIMM
Maximum C 1333 MHz
Organization 512Mx72
Total Density 4 GB
Sub Category DDR3 SDRAM
Supplier Mini-RDIMM
Data Bus Width 72 Bit
Main Category DRAM Module
Описание продукта 82.15 x 3.8 x 30.15 mm
Number Of 18
Minimum O 1.425 V
Maximum O 1.575 V
Chip Density 2 Gbit
Рабочая температура 0 to 70 °C
Maximum O 927 mA
Screening Level Commercial
Chip Pack FBGA
SKU: MT18JSF51272PKZ-1G4K1 Поставщик: по запросу