Contactless EEPROM DIE
Contactless EEPROM DIE
ISO/IEC 18000-3 mode 1 1 fixed sector Up to 65,536 units, support of anti-tearing 224Byte 64Byte Unique serial number, individual page locking Typically up to 1.5m 26.48kbit/s 100,000 10 years NiAu-bump, Wafer, MCC2, MCC8 Evaluation Kit Contactless
Характеристики
| Бренд | Infineon |
|---|---|
| Max Proce | 245 |
| Описание продукта | mm |
| Msl Level | 3 |
| Supplier | Die |
| Рабочая температура | -25 to 70 °C |
| Schedule B | 8542330000 |
| HTSN | 8542330001 |
| Category | Contactless EEPROM |
SKU: SRF 55V02P HC NB