Conn Board to Board

The MICRODOT HDSM connector is designed for 4 row .050 [1.27] pitch density with a special low force twist pin that meets all requirements of MILDTL-55302 and MIL-DTL- 83513. This high density connector allows the use of construction to double the packaging density with surface mount capability.

• Designed for surface mounting on both daughter board and mother board for increased circuit density
• High reliability twist pin and socket per MIL-DTL-83513 and MIL-DTL-55302
• Connector permits lateral movement of daughter board to accommodate clamping of the heatsink
• Plated through-hole mounting available
• Available with flying leads
• Extender card option available
• Designed to withstand vapor phase soldering
• Two rotatable (six position) polarizing keys are provided accommodating 36 possible combinations
• Different modular inserts may be specified to include coax (Pixi/Con), fiber optic or other special contacts
• Inserts may be partially or fully loaded and installed in the connector shell in various configurations