Conn Backplane PL Press ST Thru-Hole

Increasing system performance is a continuous challenge within the interconnection channel. One design approach gaining momentum in the industry is the reduction of the system characteristic impedance from 100 ohm to 85 ohm. Such a reduction of impedance from 100 ohm to 85 ohm can improve overall system performance by incorporating thinner PC boards, increasing density with same board thickness and making it easier to match the system impedance to the connector footprint impedance. is leading the way in providing a complete interconnect solution for this emerging market. The suite of Z-PACK TinMan 85 ohm connectors provides the same industry leading performance and features and benefits designed into the standard 100 ohm Z-PACK TinMan connector system but in an 85 ohm impedance package. This connector was designed to provide 85 ohm nominal characteristic impedance through the entire connector, from PCB footprint to PCB footprint. As part of the complete Z-PACK TinMan connector product family, the 85 ohm version offers protected right-angle and vertical receptacles for use on daughtercards and mezzanine boards where handling damage can be a concern when plugging to a mating header. Ground contacts strategically positioned within each column of the connector, combined with unique contact lead frame arrangements, enable the Z-PACK TinMan 85 ohm connector to achieve low crosstalk and high throughput performance levels. A dual point of contact mating interface and compliant pin interface to printed circuit board help provide reliability.

• 10+ Gbps performance
• 85 ohm impedance for differential pair configuration
• 5 pair version offers 26 pairs/10mm [66 differential pairs/inch] fitting within a 25.40 [1.00] card slot pitch
• Right angle pin headers (coplanar) in 5 pair versions
• Vertical receptacles (mezzanine) in 5 pair version
• High speed cable assemblies and hardware
• Reliable, redundant contact design on every signal contact
• Modular system offered in various column versions
• Meets industry reliability requirements of Bellcore/Telcordia
• Sequencing for ground and signal contacts
• RoHS compliant