Buffer/Driver 2-CH Inverting Open Drain CMOS 6-Pin X2SON T/R

The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 2). The output of the SN74AUP2G06 device is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions. NanoStar package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

Available in the Texas Instruments NanoStar™ Package

Low Static-Power Consumption (I_CC = 0.9 µA Maximum)

Low Dynamic-Power Consumption
(C_pd = 4.3 pF Typical at 3.3 V)

Low Input Capacitance (C_i = 1.5 pF Typical)

Low Noise – Overshoot and Undershoot
<10% of V_CC

I_off Supports Partial-Power-Down Mode Operation

Wide Operating V_CC Range of 0.8 V to 3.6 V

Optimized for 3.3-V Operation

3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation

t_pd = 4.3 ns Maximum at 3.3 V

Suitable for Point-to-Point Applications

Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II

ESD Performance Tested Per JESD 22

• 2000-V Human-Body Model
  (A114-B, Class II)
• 1000-V Charged-Device Model (C101)