Applications Processor 423-Pin BGA Tray

OMAP3530 and OMAP3525 devices are available in a 515-pin s-PBGA package (CBB suffix), 515-pin sPBGA package (CBC suffix), and a 423-pin s-PBGA package (CUS suffix). Some features of the CBB and CBC packages are not available in the CUS package.This data manual presents the electrical and mechanical specifications for the OMAP3530 and OMAP3525 applications processors. The information in this data manual applies to both the commercial and extended temperature versions of the OMAP3530 and OMAP3525 applications processors unless otherwise indicated.

• OMAP™ 3 Architecture
• MPU Subsystem
  • Up to 720-MHz ARM® Cortex™-A8 Core
  • NEON™ SIMD Coprocessor
• High-Performance Image, Video, Audio (IVA2.2™) Accelerator Subsystem
  • Up to 520-MHz TMS320C64x+™ DSP Core
  • Enhanced Direct Memory Access (EDMA) Controller (128 Independent Channels)
  • Video Hardware Accelerators
• PowerVR® SGX™ Graphics Accelerator (OMAP3530 Device Only)
  • Tile-Based Architecture Delivering up to 10 MPoly/sec
  • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
  • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
  • Fine-Grained Task Switching, Load Balancing, and Power Management
  • Programmable High-Quality Image Anti-Aliasing
• Fully Software-Compatible with C64x and ARM9™
• Commercial and Extended Temperature Grades