EMI Filter Solder SMD T/R

The EMIF02-MIC03F2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interferences. The EMIF02 Flip-Chip packaging means the package size is equal to the die size.This filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges up 15 kV.

EMI symmetrical (I/O) low-pass filter

High efficiency in EMI filtering

Very low PCB space consuming:1.07 mm x 1.47 mm

Very thin package: 0.65 mm

High efficiency in ESD suppression

High reliability offered by monolithic integration

High reducing of parasitic elements through integration and wafer level packaging

Complies with the following standards:

IEC 61000-4-2 level 4, on output pins

15 kV (air discharge)

8 kV (contact discharge)

IEC 61000-4-2 Level 1, on input pins

2 kV (air discharge)

2 kV (contact discharge)

MIL STD 883E - Method 3015-6 Class 3