Cortex based Processor

Microchip"s SAM3U series is a member of a family of Flash microcontrollers based on the high performance32-bit ARM Cortex-M3 RISC processor. It operates at a maximum speed of 96 MHzand features up to 256 Kbytes of Flash and up to 52 Kbytes of SRAM. The peripheral setincludes a High Speed USB Device port with embedded transceiver, a High Speed MCI forSDIO/SD/MMC, an External Bus Interface with NAND Flash controller, up to 4xUSARTs(SAM3U1C/2C/4C have 3), up to 2xTWIs (SAM3U1C/2C/4C have 1), up to 5xSPIsSAM3U1C/2C/4C have 4), as well as 4xPWM timers, 3xgeneral purpose 16-bit timers, an RTC,a 12-bit ADC and a 10-bit ADC. The SAM3U architecture is specifically designed to sustain high speed data transfers. It includesa multi-layer bus matrix as well as multiple SRAM banks, PDC and DMA channels that enable itto run tasks in parallel and maximize data throughput. It can operate from 1.62V to 3.6V and comes in 100-pin and 144-pin LQFP and BGA packages. The SAM3U device is particularly well suited for USB applications: data loggers, PC peripheralsand any high speed bridge (USB to SDIO, USB to SPI, USB to External Bus Interface).

• Core
  • ARM® Cortex®-M3 revision 2.0 running at up to 96 MHz
  • Memory Protection Unit (MPU)
  • Thumb®-2 instruction set
• Memories
  • From 64 to 256 Kbytes embedded Flash, 128-bit wide access, memory accelerator, dual bank
  • From 16 to 48 Kbytes embedded SRAM with dual banks
  • 16 Kbytes ROM with embedded bootloader routines (UART, USB) and IAP routines
  • Static Memory Controller (SMC): SRAM, NOR, NAND support. NAND Flash controller with 4 Kbytes RAM buffer and ECC
• System
  • Embedded voltage regulator for single supply operation
  • POR, BOD and Watchdog for safe reset
  • Quartz or resonator oscillators: 3 to 20 MHz main and optional low power 32.768 kHz for RTC or device clock.
  • High precision 8/12 MHz factory trimmed internal RC oscillator with 4 MHz Default Frequency for fast device startup
  • Slow Clock Internal RC oscillator as permanent clock for device clock in low power mode
  • One PLL for device clock and one dedicated PLL for USB 2.0 High Speed Device
  • Up to 17 peripheral DMA (PDC) channels and 4-channel central DMA
• Low Power Modes
  • Sleep and Backup modes, down to 2.5 µA in Backup mode
  • Backup domain: VDDBU pin, RTC, 32 backup registers
  • Ultra low power RTC: 0.6 µA
• Peripherals
  • USB 2.0 Device: 480 Mbps, 4-kbyte FIFO, up to 7 bidirectional Endpoints, dedicated DMA
  • Up to 4 USARTs (ISO7816, IrDA®, Flow Control, SPI, Manchester support) and one UART
  • Up to 2 TWI (I2C compatible), 1 SPI, 1 SSC (I2S), 1 HSMCI (SDIO/SD/MMC)
  • 3-Channel 16-bit Timer/Counter (TC) for capture, compare and PWM
  • 4-channel 16-bit PWM (PWMC)
  • 32-bit Real Time Timer (RTT) and RTC with calendar and alarm features
  • 8-channel 12-bit 1MSPS ADC with differential input mode and programmable gain stage, 8-channel 10-bit ADC
• I/O
  • Up to 96 I/O lines with external interrupt capability (edge or level sensitivity), debouncing, glitch filtering and on-die Series Resistor Termination
  • Three 32-bit Parallel Input/Outputs (PIO)
• Packages
  • 100-lead LQFP, 14 x 14 mm, pitch 0.5 mm
  • 100-ball TFBGA, 9 x 9 mm, pitch 0.8 mm
  • 144-lead LQFP, 20 x 20 mm, pitch 0.5 mm
  • 144-ball TFBGA, 10 x 10 mm, pitch 0.8 mm