Development Tool A42MX Programming Adaptor

This line of ‘MELF’ high power PIN diodes are hermetically sealed surface mount packaged devices with full face bonded chips for low inductance construction. The MELF ceramic package has square end terminations which are ideal for surface mount and pick and place operations. The PIN diode chips are coated with a special hard glass passivation which is required for high power applications and to enhance the reliability resulting in MTBFs of greater than one million hours. RoHS compliant versions of these products meet RoHS requirements per EU Directive 2002/95/EC. The standard terminal finish is gold unless otherwise specified. Consult the factory if you have special requirements.

• Non-Magnetic1 Versions Ideal for MRI Applications
• Very Low Inductance, Full Face Bonding
• Hi-Rel Hermetic Design
• Surface Mount Devices Available in Tape and Reel
• RoHS Compliant2 Versions Available