MAX14900E Octal High-Speed Industrial High-Side Switch Evaluation Kit

The MAX14900E is an octal power switch that features per-channel configuration for high-side or push-pull operation. Low propagation delay, high-rate load-switching makes the device suitable for next-generation highspeed PLC systems. Each high-side switch sources 850mA continuous current with a low 165mO (max) on-resistance at 500mA at TA = +125°C. The high-side switches feature 2µs (max) input-to-output propagation delay when driving resistive loads. Long cables can be driven with switching rates of up to 100kHz for PWM/PPO control in push-pull operation. Multiple high-side switches can be connected in parallel to achieve higher drive currents. The device features a wide supply input range of 10V to 36V. The MAX14900E is configured, monitored, and driven by an SPI and/or parallel interface. In parallel mode, eight logic inputs directly control the outputs and the serial interface can be used for configuration/monitoring. Serial mode utilizes the serial interface for both setting and configuration, and features CRC error detection to ensure robust SPI communication. Current limiting and per-channel thermal shutdown protect each switch/driver. The device features a global diagnostics output as well as per-channel diagnostics and monitoring through the serial interface. The MAX14900E is available in a 48-pin (7mm x 7mm) QFN-EP or standard 48-pin TQFN-EP package, and is specified over the -40°C to +125°C temperature range.

• Low Power for High-Density Modules
  • 3mA (max) Total Supply Current
  • 165mO (max) High-Side R_ON at +125°C

Fast Switching Ideal for Accurate, High-SpeedControl Systems

• 2µs Propagation Delays (High-Side Mode)
• 0.8µs Propagation Delays (Push-Pull Mode)
• 100kHz (max) Push-Pull Mode Switching Rate

Extensive Fault Feedback Eases Maintenance andReduces Installation Time

• Global and Per-Channel Diagnostics
• Open Load/Wire Detection
• Thermal Shutdown Fault Indication
• Output Logic State Feedback
• Undervoltage Lockout

Small Packages with Serial Interface Allows MakingHigh-Density Modules

• Daisy-Chainable SPI Minimizes Isolation Cost
• 7mm x 7mm, 48-Pin QFN and TQFN Packages