Bumped Wafer
Bumped Wafer
规格参数
| Brand | NXP |
|---|---|
| Typical O | 2.5000 V |
| Power Sup | Analog |
| Product description | mm |
| Operating temperature | -25 to 85 °C |
| Schedule B | 8542320050 |
| Type Prod | Bumped Wafer |
| Category | Bumped Wafer |
| HTSN | 8542320051 |
| Country of origin | China |
| Supplier | Wafer |
| Maximum O | 2.7 V |
SKU: SL2ICS5301EW/V7,005